摘要
随着新能源汽车电动化、网联化、智能化的发展,车规芯片的信息安全问题越来越重要。其中温度影响是芯片信息安全不可忽视的因素,然而此领域目前还没有成熟的评价方法,本文探索性地分析了温度对芯片的干扰机理,对电气性能、安全性能的影响,结合实际需求,选择关联影响参数,设计了一种有效的安全芯片温度度量测试模型。测试结果表明,该测试模型能够反映温度对芯片信息安全的影响,直观体现车规芯片与非车规芯片性能差异。
With the development of electrification,networking,and intelligence in new energy automobile,the issues of information security for automotive chip is becoming increasingly important.Temperature is the factor that cannot be ignored in its impact on secure chips without a proper evaluation method.This paper analyzes exploratively the temperature interference mechanism of chips,its effects on electrical and security performance,selects related influencing parameters with consideration of practical requirements.A temperature measurement test model for secure chips has been designed.The results demonstrate that it can reflect the influence of temperature on information security of chips and intuitively highlight the performance differences between automotive and non-automotive chips.
作者
徐宏坤
杜新
杨利华
潘亮
XU Hong-kun;DU Xin;YANG Li-hua;PAN Liang(CEC Huada Electronic Design Co.,Ltd.,Beijing Key Laboratory of RFID Chip Test Technology)
出处
《中国集成电路》
2024年第11期74-77,86,共5页
China lntegrated Circuit
基金
国家重点研发计划项目:(2021YFB2501404):车规安全芯片信息安全度量的测试技术研究。
关键词
车规芯片
信息安全
温度影响
测试模型
automotive chips
information security
temperature interference
test model
