摘要
焊膏印刷是SMT生产中关键工序之一 ,其控制直接影响着组装板的质量。介绍了焊膏印刷中影响质量的诸多因素并分析其原因 ,同时提出部分纠正措施和建议。
Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies. The article introduces many factors of infecting quality in Solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
出处
《电子工业专用设备》
2002年第3期176-179,共4页
Equipment for Electronic Products Manufacturing
