摘要
面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实现了各芯片之间的高速互连。此外,利用无硅通孔转接板工艺完成了DDR芯片从引线键合到倒装的封装形式的重构,在保证传输距离的同时也保证了芯片封装尺寸的最小化。在35 mm×40 mm的封装尺寸内实现了一个具备数字信号处理功能的最小系统。所涉及到的技术为通用基础技术,可广泛应用于其他高密度封装产品中。
For high-density digital system in packaging(SiP)applications,adopting the multi-chip integrated packaging technology,and the digital signal processor(DSP)and peripheral DDR3,SPI Flash,Nor Flash,Nand Flash,and low-dropout linear regulator(LDO)chips are integrated in the system,and the high speed interconnection between the chips is realized based on the high-density ceramic packaging substrate and the surface multi-layer thin film process.In addition,the reconfiguration of the DDR chip from wire bonding to flip chip packaging has been completed by using the non-silicon through via interposer process,which ensures the transmission distance while minimizing the chip packaging size.A minimal system with digital signal processing functions is realized within a packaging size of 35 mm×40 mm.The technologies involved are general basic technologies that can be widely used in other high-density packaging products.
作者
柴昭尔
卢会湘
徐亚新
李攀峰
王杰
田玉
王康
韩威
尹学全
CHAI Zhao′er;LU Huixiang;XU Yaxin;LI Panfeng;WANG Jie;TIAN Yu;WANG Kang;HAN Wei;YIN Xuequan(China Electronics Technology Group Corporation No.54 Research Institute,Shijiazhuang 050081,China;Hebei Branch of China Communication System Co.,Ltd.,Shijiazhuang 050200,China;National Engineering Research Center of Communication Software and Asic Design,Shijiazhuang 050081,China;Shijiazhuang Nuotong Human Resources Co.,Ltd.,Shijiazhuang 050035,China)
出处
《电子与封装》
2025年第1期24-28,共5页
Electronics & Packaging
关键词
陶瓷基板
多层薄膜
封装重构
ceramic substrate
multi-layer thin film
packaging reconfiguration
