摘要
晶圆传输机器人是晶圆传输过程中的重要设备,主要承担晶圆的高精度、高速、稳定传输任务.而作为直接接触晶圆的传输机械手指,很大程度上会决定着晶圆传输的可靠性.针对晶圆搬运过程中的无损高刚度要求和轻量化设计目标,本文提出了一种基于伯努利排气负压原理的超薄机械手指结构.该机械手指整体厚度5 mm,装有6个吸盘,供给气体从吸盘圆筒侧面喷口高速喷出,在筒内形成旋转气流致负压,吸附晶圆,随后经机械手指与晶圆间隙释放至外界.此气流在吸盘与晶圆之间形成稳定层流,造成晶圆上下压力差,最终实现晶圆向上吸附力.仿真结果表明,晶圆吸附力与吸盘供气压力呈近似线性关系,与吸盘和晶圆的间隙遵循指数函数关系.当间隙为0.6 mm时,吸附力效果达到最优.
Wafer transmission robot is an important equipment in the process of wafer transmission,which mainly undertakes the task of high-precision,high-speed and stable wafer transmission.As a direct contact with the wafer transmission mechanical finger,to a large extent,will determine the reliability of wafer transmission.In order to meet the requirement of high stiffness and light weight in wafer handling,an ultra-thin manipulator structure based on Bernoulli’s principle of exhaust negative pressure is proposed in this paper.The overall thickness of the manipulator finger is 5 mm,and is equipped with 6 suction cups.The supply gas is ejected from the side nozzle of the suction cup cylinder at high speed,forming a rotary air flow in the cylinder to cause negative pressure,adsorbing the wafer,and then releasing to the outside world through the gap between the manipulator finger and the wafer.The airflow forms a stable laminar flow between the suction cup and the wafer,causing the pressure difference between the wafer and the upper and lower,and finally realizing the upward adsorption force of the wafer.The results show that the relationship between wafer sorption and suction pressure is approximately linear,and the relationship between wafer sorption and suction gap is exponential function.When the gap is 0.6 mm,the effect of adsorption force is optimal.
作者
余少强
周海波
徐云浪
李嘉俊
Yu Shaoqiang;Zhou Haibo;Xu Yunlang;Li Jiajun(College of Mechanical and Electrical Engineering,Central South University,Changsha 410083,China;State Key Laboratory of Precision Manufacturing for Extreme Science Performance,Central South University,Changsha 410083,China)
出处
《动力学与控制学报》
2024年第12期29-36,共8页
Journal of Dynamics and Control
基金
湖南省科技创新计划项目(2021JC0005)。
关键词
伯努利原理
晶圆机器人
机械手指
超薄晶圆
Bernoulli principle
wafer robot
mechanical finger
ultra-thin wafer
