摘要
阐述了陶瓷、玻璃等无机非金属材料与金属及金属基复合材料场致扩散连接的原理、应用及其发展前景。认为这种低温、低压、快速的连接方法特别适用于功能陶瓷材料与金属的连接 ,适用于微型仪表及机械的制造 。
The principle,application and development of field assisted bonding between metal and ceremic or glass are narrated.This quick bonding method with low press and low temperature is suitable to micromichanism manafacture and will have more development.
出处
《太原理工大学学报》
CAS
2003年第2期173-177,共5页
Journal of Taiyuan University of Technology
