摘要
综述了非金属表面化学镀前处理工艺的现状和发展,对陶瓷化学镀的粗化和活化工艺的新进展进行了评述,侧重讨论了离子型、胶体钯型、浆料型、分子自组装吸附钯型、贱金属型活化工艺特点和进展,并展望了今后发展方向。
The new developing of pretreatment processes for electroless plating of nonmetallic materials were reviewed, especially for the chemical roughen and activating processes of electroless plating on ceramic surface. The technical characteristics of several activating processes were discussed, and the developing of pretreatment process was prospected.
出处
《材料保护》
CAS
CSCD
北大核心
2003年第9期1-4,共4页
Materials Protection
关键词
陶瓷
化学镀
前处理工艺
化学粗化
活化
ceramic
electroless plating
pretreatment process
chemical roughen
activating
