摘要
欧盟通过法令限制电子用品中铅等有害物质的使用,含铅电子产品不久将退出市场,电子封装的无铅化已成必然趋势。焊料的无铅化是无铅封装的关键,目前无铅焊料的研究集中在Sn基焊料和导电胶粘剂两个方向。文中介绍了三种典型无铅焊料体系的不足之处,以及银导电胶研究中的三个难题。另外,关于无铅焊料还没有一个统一的标准。
The European Union has passed two prescripts to restrict the use of lead and orther injurant in electronic products. The products containing lead will be eliminated in market soon. Lead-free solder is the key to electronic assembly engineering (lead-free package). Now the research on lead-free solder focuses on two fields: Sn base solder and conductive adhesive. The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed. So far, there is no international standard about the use of lead-free solder.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第3期29-31,共3页
Electronic Components And Materials
关键词
无铅焊料
银导电胶
无铅焊料标准
lead-free solder
silver conductive adhesive
lead-free solder standard
