摘要
从硅材料的物理性能出发 ,分析其微细电火花加工的可行性。对未掺杂单晶硅和掺杂N型硅进行了电火花加工工艺试验 ,得出了掺杂N型硅有很好的微细电火花加工性能的结论。硅材料在电火花加工机理上除了熔化与汽化外 ,还有比较明显的热剥蚀作用。因此提高硅表面加工质量 ,必须将单脉冲放电能量控制得尽可能的低。
This paper analyses the micro EDM feasibility for semiconductor silicon from the physical properties of silicon. And draws a conclusion that doped N type monocrystal silicon is quite fit for micro EDM, while a non doped one isn’t by a lot of EDM experiments. Experiments show that the silicon material is removed by not only melting and vaporing action, but also the heat denudation action is very important. In order to gain the smooth silicon surface without micro crack, it is essential to drop the single pulse energy.
出处
《电加工与模具》
2004年第1期13-16,共4页
Electromachining & Mould
