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A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module 被引量:1
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作者 Xiaoshuang Hui Puqi Ning +4 位作者 Tao Fan Yuhui Kang Kai Wang Yunhui Mei Guangyin Lei 《CES Transactions on Electrical Machines and Systems》 EI CSCD 2024年第1期72-79,共8页
Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple stake... Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint. 展开更多
关键词 Silicon carbide Electric vehicle Power modules package
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基于SIP的FPGA驱动电压补偿测试研究
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作者 黄健 陈诚 +2 位作者 王建超 李岱林 杜晓冬 《现代电子技术》 北大核心 2025年第4期30-33,共4页
在基于SIP的现场可编程门阵列(FPGA)性能参数验证测试时,驱动电压测试会受到多种因素的影响,如PCB线阻、插座信号损耗以及测试温度等,这些因素导致ATE测试的实测值与真实值之间存在偏差。为了提高驱动电压的测试精度,提出一种基于卷积... 在基于SIP的现场可编程门阵列(FPGA)性能参数验证测试时,驱动电压测试会受到多种因素的影响,如PCB线阻、插座信号损耗以及测试温度等,这些因素导致ATE测试的实测值与真实值之间存在偏差。为了提高驱动电压的测试精度,提出一种基于卷积神经网络(CNN)与长短时记忆(LSTM)网络的误差补偿方法。将PCB线长、测试温度等参数作为特征输入到CNN-LSTM模型中,模型经过训练迭代后能够预测出驱动电压的误差值;再将预测的误差值应用于ATE测试机中,对实测值进行补偿和修正,从而使得测试结果更加接近真实值。实验结果表明,所提方法能够有效地减小测试误差,提高FPGA驱动电压测试的准确性。 展开更多
关键词 驱动电压测试 误差补偿 系统级封装(sip)技术 现场可编程门阵列 卷积神经网络 长短时记忆网络
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Vehicle-oriented ridesharing package delivery in blockchain system
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作者 Xuefei Zhang Junjie Liu +4 位作者 Yijing Li Qimei Cui Xiaofeng Tao Ren Ping Liu Wenzheng Li 《Digital Communications and Networks》 SCIE CSCD 2024年第4期1014-1023,共10页
Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may r... Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm. 展开更多
关键词 Blockchain Dynamic matching Ridesharing package delivery
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Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment
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作者 Yongliang Zhang Lu Zhan Zhenming Xu 《Engineering》 SCIE EI CAS CSCD 2024年第8期253-261,共9页
Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious an... Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits. 展开更多
关键词 Waste LED Hydrothermal treatment RECYCLING Plastic PPA degradation packaging materials
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DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages
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作者 Mingzhou Liu Yu Gong +2 位作者 Xiaoqiao Wang Conghu Liu Jing Hu 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2024年第4期194-214,共21页
Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line d... Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects. 展开更多
关键词 Surface defect detection system Deep learning Semantic segmentation Aluminum-plastic blister packages identification
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Intervention package on stress management: Improving comprehensive well-being among nurses
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作者 Manda Jaywant PHUKE Tukaram ZAGADE +3 位作者 Vaishali Rajsinh MOHITE Jyoti SALUNKHE Swati INGALE Samir Kasam CHOUDHARI 《Journal of Integrative Nursing》 2024年第4期201-208,共8页
Objective:The main objective of this study is to investigate the effectiveness of the stress management intervention package in improving stress-related burnout.Materials and Methods:An experimental study was done on ... Objective:The main objective of this study is to investigate the effectiveness of the stress management intervention package in improving stress-related burnout.Materials and Methods:An experimental study was done on 300 nurses selected by a nonprobability convenience sampling technique and a quasi-experimental one-group pre-and posttest research design was utilized.Modified expanded nurses stress scale and self-structured three-point Likert scale on the challenges that nurses may face following stressful life events utilized to collect information.The nurses signed up for six interactive sessions on various stress-coping methods by utilizing a variety of teaching strategies such as lecture cum discussion,video slides,group work,and direct interaction with the experts to explore stress-related issues.Results:Continuous stress affects both the body and the mind,causing psychosomatic symptoms.Data found that 2%to 10%of nurses frequently suffered with physical symptoms such as exhaustion,backache,acidity,headache,shoulder stiffness,and insomnia.Following the intervention,the number of nurses who had these symptoms frequently and sometimes decreased.Previously,10%of nurses experienced emotional symptoms frequently;however,after intervention,this figure was reduced to<2%.The greatest proportion of nurses(18%)reported frequently worrying,while 1.3%expressed frequent worrying after intervention.Maximum(5%)of nurses had a tendency to eat too little or too much;this has been reduced to 0.3%after the intervention.The intervention package on stress management significantly improved nurses’Conclusion:An intervention package for stress management was helpful in lowering physical,emotional,psychological,and behavioral stress-related symptoms among nurses. 展开更多
关键词 COMPREHENSIVE intervention package nurses STRESS WELL-BEING
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Ex⁃situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation
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作者 WANG Long GAO Zizhan +3 位作者 ZHANG Xuanhao LIU Qiaoyu HOU Chuantao XING Ruisi 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2024年第5期609-620,共12页
In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is... In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions. 展开更多
关键词 ball grid array(BGA)packages digital volume correlation ex-situ rigid body displacement thermal cycling test
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SIPS模型在皮革制品企业营销实践中的应用研究
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作者 王月婷 陈珊珊 《中国皮革》 2025年第3期114-120,共7页
随着社交媒体的发展和消费者需求的多样化,皮革制品企业需要根据时代发展的特点不断优化营销策略,以推动企业品牌建设和可持续发展。本文针对皮革制品企业品牌营销需求,以及SIPS模型在皮革制品企业品牌营销实践中的应用现状及问题,提出... 随着社交媒体的发展和消费者需求的多样化,皮革制品企业需要根据时代发展的特点不断优化营销策略,以推动企业品牌建设和可持续发展。本文针对皮革制品企业品牌营销需求,以及SIPS模型在皮革制品企业品牌营销实践中的应用现状及问题,提出以“共鸣”为轴,激发消费者品牌认同;以“确认”为引,形成自主开发与联合开发融合发展格局;以“参与”为媒,创建具有交互增值体验的营销场景;以“扩散”为本,依托多触点营销网络提升品牌溢价的营销策略,以期帮助我国皮革制品企业提升市场竞争力。 展开更多
关键词 皮革制品 sipS模型 营销实践
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Study on the Package Design Effect on Low-Calorie Snacks: Analyzing the Basic Behavior of Emotional Design in Low-Calorie Snacks Focused on Delight Project
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作者 Yuran Yang Yuyan Wang Euitay Jung 《Psychology Research》 2024年第6期187-195,共9页
Healthcare is an important issue,and obesity has become one of the main causes of health problems.Therefore,reasonable and healthy diet has entered the public agenda,and low calories have become an important choice fo... Healthcare is an important issue,and obesity has become one of the main causes of health problems.Therefore,reasonable and healthy diet has entered the public agenda,and low calories have become an important choice for consumers.Low-calorie snack brands are emerging in endlessly at the top of the market.This article analyzes the packaging effect of low-calorie snacks,and uses emotional design to analyze the psychological impact of low-calorie package design on points of purchase.Emphasis is placed on the design of colors,cultural codes,and layout to analyze and discuss the emotional and behavioral responses of consumers,considering the interplay between visual packaging and emotional responses.Finally,by analyzing the effect of low-calorie snack packaging,this study emphasizes the empathy contained in the design,and summarizes the necessity of its emotional design and how to promote the innovation and development of low-calorie brands. 展开更多
关键词 low calorie snack packaging emotional design cultural code
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文旅融合背景下基于SIPS模型的公共图书馆阅读推广服务策略研究
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作者 饶恩惠 刘景会 《河南图书馆学刊》 2025年第2期18-20,共3页
文章总结分析了文旅融合背景下公共图书馆阅读推广服务实践的现状及存在的问题,提出了基于SIPS模型的公共图书馆阅读推广服务策略,即促进多元主体高效联动,提高服务内容精度,拓展服务内容深度,打造沉浸式体验空间,拓宽服务营销渠道,以... 文章总结分析了文旅融合背景下公共图书馆阅读推广服务实践的现状及存在的问题,提出了基于SIPS模型的公共图书馆阅读推广服务策略,即促进多元主体高效联动,提高服务内容精度,拓展服务内容深度,打造沉浸式体验空间,拓宽服务营销渠道,以期推动图书馆阅读推广服务的高质量开展。 展开更多
关键词 公共图书馆 sipS模型 文旅融合 阅读推广
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面向高密度数字SiP应用的封装工艺研究
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作者 柴昭尔 卢会湘 +6 位作者 徐亚新 李攀峰 王杰 田玉 王康 韩威 尹学全 《电子与封装》 2025年第1期24-28,共5页
面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实... 面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实现了各芯片之间的高速互连。此外,利用无硅通孔转接板工艺完成了DDR芯片从引线键合到倒装的封装形式的重构,在保证传输距离的同时也保证了芯片封装尺寸的最小化。在35 mm×40 mm的封装尺寸内实现了一个具备数字信号处理功能的最小系统。所涉及到的技术为通用基础技术,可广泛应用于其他高密度封装产品中。 展开更多
关键词 陶瓷基板 多层薄膜 封装重构
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基于SIP封装的电源完整性分析与优化
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作者 卞玲艳 蔡莹 +1 位作者 周倩蓉 陆霄 《电子设计工程》 2025年第6期25-29,共5页
针对系统级封装尺寸小、供电电压低、工作电流大以及对电源完整性要求高的特殊性,对SIP(System in Package)中基板设计进行电源仿真和优化。通过仿真指导基板设计,提高SIP产品的设计成功率,缩短设计周期。通过Power DC软件进行了直流压... 针对系统级封装尺寸小、供电电压低、工作电流大以及对电源完整性要求高的特殊性,对SIP(System in Package)中基板设计进行电源仿真和优化。通过仿真指导基板设计,提高SIP产品的设计成功率,缩短设计周期。通过Power DC软件进行了直流压降和电流密度的仿真分析,根据电源完整性相关理论,讨论基板设计中电源平面的影响因素,结合版图分析,给出实际的优化方案,并经过仿真迭代验证,使所设计的基板满足产品性能要求。 展开更多
关键词 sip系统级封装 电源仿真 电源完整性 电源分布网络
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SiP外壳陶瓷裂纹及开短路异常分析与改进研究
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作者 莫仲 邵金涛 +3 位作者 陈骏 李傲奇 李航 韩添 《固体电子学研究与进展》 2025年第1期102-109,共8页
SiP陶瓷外壳具有高集成度、高可靠性、易拆解便于故障定位等特点,在通信、航空、航天等领域得到了广泛应用,然而,陶瓷体在长期服役过程中可能出现裂纹及开短路异常等可靠性问题。本文从微观角度分析了SiP外壳缺陷的产生原因。利用复合... SiP陶瓷外壳具有高集成度、高可靠性、易拆解便于故障定位等特点,在通信、航空、航天等领域得到了广泛应用,然而,陶瓷体在长期服役过程中可能出现裂纹及开短路异常等可靠性问题。本文从微观角度分析了SiP外壳缺陷的产生原因。利用复合型材料断裂曲线图,结合无损检测和金相、SEM-EDS等分析技术,详细探讨了SiP外壳陶瓷的疲劳强度及开短路失效机制。通过优化结构设计与制造工艺,有效解决了陶瓷裂纹和开短路异常问题。 展开更多
关键词 陶瓷裂纹 开路 短路 sip外壳
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Graphene Oxide and Moringa oleifera Seed Oil Incorporated into Gelatin-Based Films:A Novel Active Food Packaging Material
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作者 María Fernanda Cardona Lunar Ramón Ordoñez +2 位作者 Heidi Fonseca Florido Joaquín Hernández-Fernández Rodrigo Ortega-Toro 《Journal of Renewable Materials》 2025年第2期311-327,共17页
The extensive use of polymeric materials in single-use packaging has driven the need to develop biodegradable alternatives.This study investigates the incorporation of graphene oxide(GO)and Moringa oleifera seed oil(M... The extensive use of polymeric materials in single-use packaging has driven the need to develop biodegradable alternatives.This study investigates the incorporation of graphene oxide(GO)and Moringa oleifera seed oil(MOSO)into a gelatin matrix to create polymer films and evaluate their potential as active packaging materials.The properties of these films were evaluated using structural,thermal,mechanical,optical,and physicochemical methods to determine their suitability for food packaging applications.The results showed that GO and MOSO were homogeneously dispersed in the gelatin matrix,forming colloidal particles(around 5μm in diameter).The addition of GO increased opacity by approximately 20 times the base value while MOSO affected light transmittance without impacting opacity.Mechanical properties were affected differently,GO acted as a crosslinking agent reducing elongation and increasing tensile strength at break,on the other hand MOSO acted as a plasticizer,making films more plastic increasing elongation a 30%.These effects counteracted each other,and similar behavior was recorded in differential scanning calorimetry.The films exhibited an improved water vapor resistance,which is crucial for food packaging.These findings indicate that the incorporation of GO and MOSO into a gelatin matrix may produce biodegradable polymer films with enhanced properties,suitable for active packaging in the food industry. 展开更多
关键词 Biodegradable packaging graphene oxide Moringa oleifera seed oil mechanical properties thermal stability water vapor resistance food packaging applications
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Active food packaging:latest development trends and future prospects
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作者 Jian Ju 《Food and Health》 2025年第2期1-2,共2页
With the growing demands for food safety,quality,and environmental protection,active food packaging is playing an increasingly vital role in the food industry.Traditional food packaging primarily protects products and... With the growing demands for food safety,quality,and environmental protection,active food packaging is playing an increasingly vital role in the food industry.Traditional food packaging primarily protects products and facilitates transportation.Active food packaging,however,not only fulfills these fundamental functions but also actively interacts with the food or its environment to extend shelf life and enhance food safety.From current research advancements and market applications,active food packaging demonstrates the following prominent development trends. 展开更多
关键词 ACTIVE packagING primarily
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SIPS模型视角下游戏IP《原神》的运营策略
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作者 李嘉慧 《电子商务评论》 2025年第1期1097-1104,共8页
互联网技术的发展革新带来了生活方式的转变,文化娱乐消费占比提高,文化创意产业的发展势头蓬勃向上,《原神》作为近年来比较热门的游戏IP在市场中发展壮大,本文借助用户SIPS模型,从共鸣、确认、参与、共享四个层面分析《原神》IP的运... 互联网技术的发展革新带来了生活方式的转变,文化娱乐消费占比提高,文化创意产业的发展势头蓬勃向上,《原神》作为近年来比较热门的游戏IP在市场中发展壮大,本文借助用户SIPS模型,从共鸣、确认、参与、共享四个层面分析《原神》IP的运营策略,对社交媒体时代用户心理和行为的发展变化进行分析,试图为IP的打造与运营提供借鉴。The development and innovation of Internet technology has brought about a change in lifestyle, the proportion of cultural and entertainment consumption has increased, and the development momentum of cultural and creative industries is booming. As a popular game IP in recent years, “Genshin Impact” has grown in the market. This article uses the user SIPS model to analyze the operation strategy of the “Genshin Impact” IP from the four aspects of “Sympathize, Identify, Participate, and Share & Spread”, and attempts to provide references for the creation and operation of IP by analyzing the development and changes in user psychology and behavior in the era of social media. 展开更多
关键词 sipS模型 《原神》 IP 运营
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Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips
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作者 Jieyuan Zhang Yanlei Hu +6 位作者 Fangcheng Wang Qiang Liu Fangfang Niu Jinhui Li Mingqi Huang Guoping Zhang Rong Sun 《International Journal of Extreme Manufacturing》 2025年第1期395-407,共13页
Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by com... Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips. 展开更多
关键词 laser debonding behaviours laser-induced hot stamping effect thermoelastic stress wave advanced packaging
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A novel BaEVRless-LV packaging system for the production of lentiviral vectors for clinical-grade CAR-NK cell manufacturing
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作者 Yinyin Zhang Minghuan Zhang +5 位作者 Mengyuan Li Lihong Zong Qian Ye Wen Lei Wenhai Deng Wenbin Qian 《Cancer Biology & Medicine》 2025年第2期137-143,共7页
Chimeric antigen receptor natural killer(CAR-NK)cell therapy is an alternative immunotherapy that provides robust tumor-eliminating effects without inducing life-threatening toxicities and graft-versus-host disease.CA... Chimeric antigen receptor natural killer(CAR-NK)cell therapy is an alternative immunotherapy that provides robust tumor-eliminating effects without inducing life-threatening toxicities and graft-versus-host disease.CAR-NK cell therapy has enabled the development of“off-the-shelf”products that bypass the lengthy and expensive cell manufacturing process1. 展开更多
关键词 LENTIVIRAL packaging VECTORS alternative immunotherapy chimeric antigen receptor natural system cell manufacturing process NOVEL
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基于SIPS模型的开封市旅游短视频营销效果优化研究
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作者 李丹阳 吴丽娜 《传播与版权》 2025年第5期39-42,共4页
随着短视频平台的普及,短视频已成为提升城市旅游形象的重要工具。文章聚焦开封市的旅游产业,采用Python爬取数据方法,以“开封文旅”官方抖音号和官方快手号为研究对象,借助ROST CM6和ROST EA软件,通过网络文本分析法,对短视频平台内... 随着短视频平台的普及,短视频已成为提升城市旅游形象的重要工具。文章聚焦开封市的旅游产业,采用Python爬取数据方法,以“开封文旅”官方抖音号和官方快手号为研究对象,借助ROST CM6和ROST EA软件,通过网络文本分析法,对短视频平台内容进行分析处理。最后,文章基于日本电通公司提出的SIPS社交媒体用户行为模型提出一系列优化策略,从而提升开封文旅对外宣传的影响力。 展开更多
关键词 开封旅游业 sipS模型 短视频营销
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Prediction of specific spoilage organisms in smoked chicken legs with modified atmosphere packaging at 4℃ using multivariate statistical analysis
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作者 Qiang Wang Yubo Zhao +5 位作者 Yumeng Sui Qian Chen Zhiming Dong Qian Liu Baohua Kong Ligang Qin 《Food Science and Human Wellness》 2025年第1期271-281,共11页
The present study monitored bacterial succession,physicochemical properties,and volatile organic compounds(VOCs)changes in smoked chicken legs with modified atmosphere packaging(MAP,60% CO_(2) and 40%N_(2))during a 25... The present study monitored bacterial succession,physicochemical properties,and volatile organic compounds(VOCs)changes in smoked chicken legs with modified atmosphere packaging(MAP,60% CO_(2) and 40%N_(2))during a 25-day storage period at 4℃.After 15 days of storage,S erratia proteamaculans and Pseudomonas fragi became the predominant bacteria.Furthermore,physicochemical properties changed significantly,as evidenced by an increase in thiobarbituric acid reactive substances and b*(yellowness)value,and a decrease in hardness.A total of 65 VOCs were identified during storage.Correlation between bacterial succession and quality indicators(including VOCs and physicochemical properties)allowed the identification of 26 core dominant bacteria,including S.proteamaculans,Psychrobacter alimentarius,Pseudomonas putida,and Pseudomonas poae,which were positively related to spoilage VOCs(e.g.,1-octen-3-ol,1-pentanol,and 3-methyl-1-butanol)and could be defined as specific spoilage organisms(SSOs).The results of this study provide a systematic approach to predict SSOs in smoked chicken legs during storage,which can also provide a basis for product safety. 展开更多
关键词 Smoked chicken legs Modified atmosphere packaging Bacterial community Volatile organic compounds Specific spoilage organisms
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