A matrix of 96 Al2O3 ceramics was implanted with Ni ion of different dosages and energies using a MEVVA implanter. Then metallic structures of copper were made on the implanted ceramics, by using selective electroless...A matrix of 96 Al2O3 ceramics was implanted with Ni ion of different dosages and energies using a MEVVA implanter. Then metallic structures of copper were made on the implanted ceramics, by using selective electroless copper plating. In addition, the characteristics and microstructure of the implanted layer were studied by using the SEM, RBS and XPS. The results show that： 1） the implanted Ni exits as Ni^2, Ni^2＋, and Ni^3＋ in the surface of Al2O3 and metal Ni particles precipitate on ceramics during implantation; 2） the concentration of Ni submits to the Gauss distribution along the direction of implantation on the surface of Al2O3 and high Ni concentration on the surface can be obtained if the Ni is implanted with low energy and a high dosage and 3） Ni ion implantation can activate the surface of Al2O3 and induce electroless copper plating on the ceramics.展开更多
基金Project BK200403 supported by the Natural Science Foundation of Jiangsu Province Project 2005A046 supported by Youth Foundation of CUMT
文摘A matrix of 96 Al2O3 ceramics was implanted with Ni ion of different dosages and energies using a MEVVA implanter. Then metallic structures of copper were made on the implanted ceramics, by using selective electroless copper plating. In addition, the characteristics and microstructure of the implanted layer were studied by using the SEM, RBS and XPS. The results show that： 1） the implanted Ni exits as Ni^2, Ni^2＋, and Ni^3＋ in the surface of Al2O3 and metal Ni particles precipitate on ceramics during implantation; 2） the concentration of Ni submits to the Gauss distribution along the direction of implantation on the surface of Al2O3 and high Ni concentration on the surface can be obtained if the Ni is implanted with low energy and a high dosage and 3） Ni ion implantation can activate the surface of Al2O3 and induce electroless copper plating on the ceramics.
