基于激光切片原理的分析,给出了厚硅片的高速激光切片方法,采用平凸腔补偿工作物质的热透镜效应,利用Nd∶YAG棒本身的自孔径选模作用,获得了光束质量因子M2等于4.19的50 W 1.064μm激光输出。选取合适的扩束倍数、重复频率和出气孔直径...基于激光切片原理的分析,给出了厚硅片的高速激光切片方法,采用平凸腔补偿工作物质的热透镜效应,利用Nd∶YAG棒本身的自孔径选模作用,获得了光束质量因子M2等于4.19的50 W 1.064μm激光输出。选取合适的扩束倍数、重复频率和出气孔直径,当切割0.75 mm厚的硅片时,切片速度达400 mm/min;当切割两层叠放的0.75 mm厚的硅片时,切片速度达到100 mm/min。切片的切口光滑,切缝较窄,重复精度高,切片质量好,达到用传统方法难以达到的切片效果。展开更多
The degradation of sulfureted hydrogen by dielectric barrier discharge was investigated.The discharge time,power,initial concentration of the gas,gas flow and humidity,which affect the decontamination efficiency,were ...The degradation of sulfureted hydrogen by dielectric barrier discharge was investigated.The discharge time,power,initial concentration of the gas,gas flow and humidity,which affect the decontamination efficiency,were studied.The methods of improving the decontaminstion efficiency were also put forwarded in the paper.展开更多
文摘The degradation of sulfureted hydrogen by dielectric barrier discharge was investigated.The discharge time,power,initial concentration of the gas,gas flow and humidity,which affect the decontamination efficiency,were studied.The methods of improving the decontaminstion efficiency were also put forwarded in the paper.
