A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the brea...A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the breakdown voltage VBR increases from 518 V to 582 V by increasing gate metal height h from 0.2μm to 0.4μm.For GaN channel HEMTs with LGD=7μm,VBR increases from 953 V to 1310 V by increasing h from 0.8μm to 1.6μm.The breakdown voltage enhancement results from the increase of the gate sidewall capacitance and depletion region extension.For Al0.4Ga0.6N channel HEMT with LGD=7μm,VBR increases from 1535 V to 1763 V by increasing h from 0.8μm to 1.6μm,resulting in a high average breakdown electric field of 2.51 MV/cm.Simulation and analysis indicate that the high gate metal height is an effective method to enhance breakdown voltage in GaN-based HEMTs,and this method can be utilized in all the lateral semiconductor devices.展开更多
The graded AlGaN:Si back barrier can form the majority of three-dimensional electron gases(3DEGs)at the GaN/graded AlGaN:Si heterostructure and create a composite two-dimensional(2D)-three-dimensional(3D)channel in Al...The graded AlGaN:Si back barrier can form the majority of three-dimensional electron gases(3DEGs)at the GaN/graded AlGaN:Si heterostructure and create a composite two-dimensional(2D)-three-dimensional(3D)channel in AlGaN/GaN/graded-AlGaN:Si/GaN:C heterostructure(DH:Si/C).Frequency-dependent capacitances and conductance are measured to investigate the characteristics of the multi-temperature trap states of in DH:Si/C and AlGaN/GaN/GaN:C heterostructure(SH:C).There are fast,medium,and slow trap states in DH:Si/C,while only medium trap states exist in SH:C.The time constant/trap density for medium trap state in SH:C heterostructure are(11μs-17.7μs)/(1.1×10^13 cm^-2·eV^-1-3.9×10^13 cm^-2·eV^-1)and(8.7μs-14.1μs)/(0.7×10^13 cm^-2·eV^-1-1.9×10^13 cm^-2·eV^-1)at 300 K and 500 K respectively.The time constant/trap density for fast,medium,and slow trap states in DH:Si/C heterostructure are(4.2μs-7.7μs)/(1.5×10^13 cm^-2·eV^-1-3.2×10^13 cm^-2·eV^-1),(6.8μs-11.8μs)/(0.8×10^13 cm^-2·eV^-1-2.8×10^13 cm^-2·eV^-1),(30.1μs-151μs)/(7.5×10^12 cm^-2·eV^-1-7.8×10^12 cm^-2·eV^-1)at 300 K and(3.5μs-6.5μs)/(0.9×10^13 cm^-2·eV^-1-1.8×10^13 cm^-2·eV^-1),(4.9μs-9.4μs)/(0.6×10^13 cm^-2·eV^-1-1.7×10^13 cm^-2·eV^-1),(20.6μs-61.9μs)/(3.2×10^12 cm^-2·eV^-1-3.5×10^12 cm^-2·eV^-1)at 500 K,respectively.The DH:Si/C structure can effectively reduce the density of medium trap states compared with SH:C structure.展开更多
基金Project supported by the National Key Science&Technology Special Project of China(Grant No.2017ZX01001301)the National Key Research and Development Program of China(Grant No.2016YFB0400100)the National Natural Science Foundation of China(Grant Nos.51777168 and 61801374).
文摘A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the breakdown voltage VBR increases from 518 V to 582 V by increasing gate metal height h from 0.2μm to 0.4μm.For GaN channel HEMTs with LGD=7μm,VBR increases from 953 V to 1310 V by increasing h from 0.8μm to 1.6μm.The breakdown voltage enhancement results from the increase of the gate sidewall capacitance and depletion region extension.For Al0.4Ga0.6N channel HEMT with LGD=7μm,VBR increases from 1535 V to 1763 V by increasing h from 0.8μm to 1.6μm,resulting in a high average breakdown electric field of 2.51 MV/cm.Simulation and analysis indicate that the high gate metal height is an effective method to enhance breakdown voltage in GaN-based HEMTs,and this method can be utilized in all the lateral semiconductor devices.
基金the National Key Research and Development Program of China(Grant No.2018YFB1802100)the Natural Science Foundation of Shaanxi Province,China(Grant Nos.2020JM-191 and 2018HJCG-20)+2 种基金the National Natural Science Foundation of China(Grant Nos.61904135,61704124,and 61534007)the China Postdoctoral Science Foundation(Grant Nos.2018M640957 and 2019M663930XB)the Wuhu and Xidian University Special Fund for Industry-University-Research Cooperation,China(Grant No.XWYCXY-012019007).
文摘The graded AlGaN:Si back barrier can form the majority of three-dimensional electron gases(3DEGs)at the GaN/graded AlGaN:Si heterostructure and create a composite two-dimensional(2D)-three-dimensional(3D)channel in AlGaN/GaN/graded-AlGaN:Si/GaN:C heterostructure(DH:Si/C).Frequency-dependent capacitances and conductance are measured to investigate the characteristics of the multi-temperature trap states of in DH:Si/C and AlGaN/GaN/GaN:C heterostructure(SH:C).There are fast,medium,and slow trap states in DH:Si/C,while only medium trap states exist in SH:C.The time constant/trap density for medium trap state in SH:C heterostructure are(11μs-17.7μs)/(1.1×10^13 cm^-2·eV^-1-3.9×10^13 cm^-2·eV^-1)and(8.7μs-14.1μs)/(0.7×10^13 cm^-2·eV^-1-1.9×10^13 cm^-2·eV^-1)at 300 K and 500 K respectively.The time constant/trap density for fast,medium,and slow trap states in DH:Si/C heterostructure are(4.2μs-7.7μs)/(1.5×10^13 cm^-2·eV^-1-3.2×10^13 cm^-2·eV^-1),(6.8μs-11.8μs)/(0.8×10^13 cm^-2·eV^-1-2.8×10^13 cm^-2·eV^-1),(30.1μs-151μs)/(7.5×10^12 cm^-2·eV^-1-7.8×10^12 cm^-2·eV^-1)at 300 K and(3.5μs-6.5μs)/(0.9×10^13 cm^-2·eV^-1-1.8×10^13 cm^-2·eV^-1),(4.9μs-9.4μs)/(0.6×10^13 cm^-2·eV^-1-1.7×10^13 cm^-2·eV^-1),(20.6μs-61.9μs)/(3.2×10^12 cm^-2·eV^-1-3.5×10^12 cm^-2·eV^-1)at 500 K,respectively.The DH:Si/C structure can effectively reduce the density of medium trap states compared with SH:C structure.
