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Tunable activity of electrocatalytic CO dimerization on strained Cu surfaces:Insights from ab initio molecular dynamics simulations 被引量:1
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作者 Hong Liu Jian Liu Bo Yang 《Chinese Journal of Catalysis》 SCIE EI CAS CSCD 2022年第11期2898-2905,共8页
Controlling catalytic activities through surface strain engineering remains a hot topic in electrocatalysis studies.Herein,ab initio molecular dynamics(AIMD)simulation associated with free energy sampling technology w... Controlling catalytic activities through surface strain engineering remains a hot topic in electrocatalysis studies.Herein,ab initio molecular dynamics(AIMD)simulation associated with free energy sampling technology were performed to study the energetics of the key step of producing C2 products in electrocatalytic reduction of CO or CO_(2),i.e.CO dimerization,on strained Cu(100)with an explicit aqueous solvent model.It is worth mentioning that when compressive strain reaches a certain extent,the surface of Cu(100)will undergo reconstruction.We showed that,from tensile to compressive strain,the free energy barrier of CO dimerization decreased,suggesting that the activity of CO dimerization increases.It was also found that some of the reconstructed surfaces showing the lowest free energy barriers but might be less stable can be stabilized in the presence of adsorbed O or CO.Upon detailed quantitative analysis on the charges of surface Cu atoms,we found that the free energy barriers were strongly correlated with the charge of Cu atoms where the OCCO intermediate adsorbs.When the surfaces structures of Cu(100)were altered under compressive strain,the electronic structure of surface Cu atoms was monitored and thus the activity of electrocatalytic CO dimerization can be tuned. 展开更多
关键词 Electrocatalytic CO dimerization Surface strain CU Surface reconstruction Ab initio molecular dynamics
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单晶二维材料生长中的层数调控机制
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作者 张磊宁 孔潇 +1 位作者 董际臣 丁峰 《Science Bulletin》 SCIE EI CAS CSCD 2023年第23期2936-2944,M0005,共10页
最近,通过将外延生长的多层二维晶畴进行无缝拼接,研究人员成功实现了晶圆级单晶二维多层材料的合成.不同于以往观察到的类似婚礼蛋糕或倒置婚礼蛋糕结构,这些多层二维晶畴中所有层都具有完全相同的尺寸和形状,即多层同步生长.基于此,... 最近,通过将外延生长的多层二维晶畴进行无缝拼接,研究人员成功实现了晶圆级单晶二维多层材料的合成.不同于以往观察到的类似婚礼蛋糕或倒置婚礼蛋糕结构,这些多层二维晶畴中所有层都具有完全相同的尺寸和形状,即多层同步生长.基于此,本文通过理论计算探索了多层二维材料的不同生长模式,提出了多层同步生长的物理模型,揭示了基底上液体异质表面层的形成是保证同步生长的关键性因素.作者指出在生长过程中,多层二维材料嵌入在衬底的异质表面层中,同时底层与固态基底直接接触.异质层能有效钝化二维材料的边缘,从而防止这些活性边缘的融合,而异质层与基底之间的高界面则迫使不同层的二维材料边缘保持同步生长.通过对多层同步生长机理的深入了解,本文揭示了发生多层同步生长的条件,为合成层数可控的晶圆级单晶二维材料提供了新的思路. 展开更多
关键词 2D materials Epitaxial growth Thickness control Synchronic growth
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